Flexi-Rigid Design Support
When your Technology requirements are such; benefit from advanced technology features such as Flexi-Rigid Design, Embedded Components and Chip-On-Board to provide you with the functionality you require.
Layer Spanned Components
Placement Sites are an intelligent methodology for placing components in critical positions. Placement Sites can be imported from DXF and allow components to snap to a precise point based on a user definable snapping tolerance.
Advanced Layer Spans
Bridge your ECAD-MCAD flows and design environments with support for STEP, DXF and IDF. Where a mechanical interface is required, the bi-directional STEP interface can utilise STEP models and import critical board outlines and positional changes.
The Chip-On-Board option provides features for creation and annotation of die & bond pads and bond wires. It also allows automatic placing bond pads around the die. Within the Pulsonix design the bond pads are treated as special pads and can move independently of die and normal pads.
Advanced Rule Sets
Pulsonix contains a set of rules that are obeyed using both the Online DRC and batch DRC processes. Rules can be set for min and max length of the bond pad from the die pad, and for the crossing over of bond wires. Conditional Spacing rules can be defined for COB devices that use smaller values for this type of detailing. This is also a highly desirable requirement where mixed conventional and bare die technologies are used.
Components which contain die and bond pads are handled intelligently using an advanced rule set. Bond pads can be interactively moved independently of the main die 'body'. This movement is controlled using the min and max length rules of the bond wire, with cross-over rules also maintained in this process. The chip die can also be moved independently of the bond pads and position reset if needed.
Constraint Driven Rules
Constraints rules are created for Micro-vias using the Pulsonix Attribute mechanism. This enables designers to easily specify Micro-via sizes and styles to be used from layers which require this specialised technology.
Micro-Via Entry Pads
Pad styles for Micro-via use can be created using the normal pad styles dialog. However, from within this, special pad styles can be specified for Micro-via Entry Pads and Micro-via Stop Pads on different layers where the landing layer for the laser drill is to be a solid pad. The technique enables stacked Micro-vias to be created where multi-drilling for stacked layers is used.
Outputs for via location by layer are available in NC Drill and report format thus ensuring your manufacturing export integrity is maintained right through to the final board production. Drill sets for laser drilling can be output based on layer class and drill type rules.
Embedded Component Technology
Passive resistors can be printed on inner layers and connected using resistive material. Depending on the manufacturing method, a resist mask or encapsulating coating will be required. Pulsonix handles this by allowing you to associate the necessary additional manufacturing layers for the resistive and other materials with the correct inner copper layer.
Buried Semiconductors & Thinned Dies
As part of the European funded Hermes project, Pulsonix has been developed well beyond the current commercial capabilities such is the belief that Pulsonix can also be used to help steer new technology into the market. The Hermes project has enabled Pulsonix to introduce the concept of 'thinned' dies and buried semiconductors into inner layer substrates.
A planar converter may exist on the outer only or through-hole layers and may have a physical body applied to the outer layers. However, part of the footprint consists of copper spirals which are connected by a component via, effectively joining the two footprint pads. By defining the footprint as embedded, the Component can be mirrored in situ and all the inner layers will swap as required. Special DRC properties also allow the checking of correct internal connectivity made on the elements of these components.
The largest array of Import Filters of any EDA product, import Designs and Libraries from your current system into Pulsonix and retain your Intellectual Property
Available Import Formats
|Vendor / Product||Versions / Formats Supported||Import Capability|
|Accel||Accel Tango and Accel EDA products||Designs and Libraries|
|Altium||Altium DXP, Altium Designer||Designs and Libraries|
|Ariadne||All information||Designs and Libraries|
|BoardMaker||BoardMaker 1 & 2||Designs and Libraries|
|Cadence||Allegro||Designs and Libraries|
|Cadence||OrCAD versions 9 to current||Designs and Libraries|
|DesignSpark||All Versions||Projects, Designs and Libraries|
|DxDesigner||DxDesigner Schematics||SCM Designs and Libraries|
|Eagle||Versions 4.09 to current||Designs and Libraries|
|Easy-PC||All Easy-PC for Windows Versions||Projects, Designs and Libraries|
|EDIF 2.0.0||EDIF netlist format||SCM Netlist import to Pulsonix PCB|
|EdWin||Schematic and PCB designs||Designs and Libraries|
|Gerber||Gerber 274D & 274X formats||Intelligent rebuild of designs into Pulsonix format|
|Integra||Schematic and PCB designs||Designs, Libraries and Projects|
|P-CAD||Master Designer||Designs and Libraries|
|P-CAD||2000-2006 formats||Designs and Libraries|
|PADS||Schematic and PCB designs||Designs and Libraries|
|PCB Artist||All Versions||Projects, Designs and Libraries|
|Protel||Protel 98, 99SE||Designs, Libraries and Projects|
|Ultiboard||Various 1-5 supported||Designs and Libraries|
|Viewlogic SCM||Schematic designs||Designs and Libraries|
|Zuken Cadstar||All Cadstar For Windows versions||Designs and Libraries|
|Zuken Visula PCB||PCB import using CADIF||PCB Designs, Footprints and Parts|
|Zuken Visula SCM
|Schematic import||SCM Designs, Schematic Symbols and Parts
using System Designer EDIF
|Zuken CR5000||PCB import||PCB Designs, Footprints and Parts using CADIF|
Listed above are the Import Filters currently available. If you cannot see the product or format you are interested in, please contact us to discuss your requirements, as there may be an Import Filter in development or we may have other ways of transferring your data.